Description

Efficient Heat Transfer for Optimal Performance
The DeepCool Z3 thermal compound is designed to enhance the cooling efficiency of your system by filling microscopic gaps between the CPU/GPU and the heatsink. With a thermal conductivity of 1.134W/m-K, it delivers stable and efficient performance even under high loads. Moreover, it ensures that heat is transferred away from your components quickly, reducing thermal throttling and improving overall system stability.

Key Features:

• High Thermal Conductivity (1.134W/m-K)

• Safe, Non-Conductive Formula

• Easy Application with Included Spatula

• Ideal for CPUs, GPUs, and Heatsinks

• Long-Lasting Stability

Easy to Use and Apply
Application is straightforward, thanks to the included spatula. Whether you’re an experienced builder or upgrading your system for the first time, the process is simple. In addition, the compound spreads smoothly, ensuring full surface contact with minimal waste. Therefore, you can expect optimal performance from your cooling solution with minimal effort.

Safe and Non-Corrosive Formula
Furthermore, the DeepCool Z3 thermal compound is completely non-conductive and non-corrosive. This means it won’t damage sensitive components, even in tight spaces. Also, its stable chemical structure prevents drying out or cracking over time, providing long-term reliability without frequent reapplication.

Great for Gaming and Workstation Builds
This thermal compound suits all types of systems, including high-performance gaming PCs and productivity workstations. In addition to supporting overclocking scenarios, it works exceptionally well with standard cooling solutions. Furthermore, it helps maintain lower CPU and GPU temperatures, improving longevity and performance across the board.

If you need advice on compatibility or installation, contact us here.